Articles for tag Lockheed Matin
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Apr
09
2024
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Posted by Admin
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OWEGO, N.Y. April. 8, 2024 – Lockheed Martin (NYSE: LMT) will work with Intel Corporation (Nasdaq: INTC), and Altera, an Intel Company, to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E). Lockheed Martin will develop a low size, weight, and power (SWaP), Sensor Open Systems Architecture (SOSA) aligned airborne electronic defense system, utilizing Altera’s Multi-Chip Package (MCP2) for expected use on the U.S. Navy’s MH-60R multi-mission helicopter. The project was awarded through the Naval Surface Warfare Center (NSWC) Crane Division Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) Other Transaction Agreement (OTA) vehicle and will be managed by the National Security Technology Accelerator (NSTXL).
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